IM156 Cell
Dimension : 156 mm x 156 mm ± 0.5 mm
Thickness(Si) : 200µm ± 20µm,180µm ± 20µm
Front : Blue silicon nitride anti-reflection coatings 1.8mm
silver busbars
Diagonal : Full-surface aluminum back-surface field 3.1mm
(silver / aluminum) discontinuous soldering pads
IM156 Cell Product Features
High conversion efficiencies resulting in superior power
output performance
Outstanding power output even in low light or high
temperature conditions
Optimized design for ease of soldering and lamination
Long-term stability, reliability and performance
Low breakage rate
Color uniformity
Dimension : 156 mm x 156 mm ± 0.5 mm
Thickness(Si) : 200µm ± 20µm,180µm ± 20µm
Front : Blue silicon nitride anti-reflection coatings 1.8mm
silver busbars
Diagonal : Full-surface aluminum back-surface field 3.1mm
(silver / aluminum) discontinuous soldering pads
IM156 Cell Product Features
High conversion efficiencies resulting in superior power
output performance
Outstanding power output even in low light or high
temperature conditions
Optimized design for ease of soldering and lamination
Long-term stability, reliability and performance
Low breakage rate
Color uniformity
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